The Design Automation Conference (DAC) in San Francisco saw Siemens, a leading player in Electronic Design Automation (EDA), unveil its latest efforts to bring digital-twin multiphysics and AI into its Calibre and Solido EDA tools for complex chip designs. With the acquisition of Mentor Graphics in 2017, Siemens has been investing heavily in EDA R&D, introducing over two dozen new EDA tools. The company’s commitment to software development has led to the creation of one of the premier EDA toolsets in the industry.
Siemens’ Solido Simulation Suite, which includes three new AI-accelerator tools, is aimed at designing mixed-signal and custom chips. The suite includes Solido SPICE, Solido FastSPICE, and Solido LibSPICE, which are powered by AI models leveraging data from semiconductor customers. The new tools are optimized to work in the cloud on AWS and Azure, offering greater flexibility and resources.
The company has also enhanced its Calibre design verification platform with multiphysics simulation for 3D IC thermal analysis, addressing the challenges of 3D IC design. Calibre 3DThermal provides color maps and temperature annotations down to the transistor level, allowing designers to analyze early design choices and providing a final thermal signoff.
In my opinion, Siemens’ innovative approach to EDA tools is set to revolutionize the chip design industry. The integration of AI and digital twin multiphysics simulation is a game-changer, enabling designers to create more accurate simulations and reducing the time and resources required for complex chip designs.
