Siemens is transforming electronic design automation (EDA) with advancements in AI and digital-twin multiphysics. At the Design Automation Conference (DAC) in San Francisco, Siemens showcased enhancements to their Calibre and Solido EDA tools, which are critical for designing complex integrated circuits (ICs). The company, which acquired Mentor Graphics in 2017, has heavily invested in EDA R&D, launching over two dozen new tools. Siemens introduced the Solido Simulation Suite, featuring AI-accelerated SPICE tools that enhance the accuracy and speed of IC simulations. These tools cater to mixed-signal and custom IC designs, ensuring high performance and manufacturability. Furthermore, Siemens unveiled Calibre 3DThermal, a groundbreaking addition to its verification platform that addresses thermal challenges in 3D IC designs. This tool integrates thermal analysis early in the design process, improving the design of chiplets, packaging, and final products. As AI continues to drive performance requirements, Siemens’ innovations in EDA will be pivotal in pushing the boundaries of IC design.
Siemens Revolutionizes Chip Design with AI and Digital Twin Technology
Siemens leverages AI and digital-twin multiphysics to revolutionize EDA tools for complex IC designs.
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